超薄筆電之高效能散熱模組

薄型筆記型電腦便於攜帶與使用,需求持續增加。受限於內部空間與成本的控制,無錫焊薄板鉚接製程得以發揮最大的優勢。
此種薄板散熱器產品架構,可以應用到各項薄型的電子產品,例如:機上盒、平板電腦或是平板燈具…等等。

開發挑戰:

  • 有限空間內的最大散熱性能
  • 10~30W 動態發熱功率
  • 極致輕量設計
  • 提昇熱交換性能,減少風扇運轉噪音

設計方案:

  • 客製化鳍片薄板無錫焊鉚接散熱模組設計
  • 在有限空間內創造最大熱交換面積

 

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