Ultra thin soldering free thermal module for slim PC

The demand for slim and light weight laptop computer requires the ultra thin thermal solution with good thermal performance. With space limitation and budget concern, soldering-free metal joint process answers the challenge.
The solution’s architecture is applicable to all slim electronics products, such as media boxes, tablets, panel lights, .. Etc.

Challenge:

• Active cooling solution in slimmest possible size
• 10~30 watts of dynamic heat flux from microprocessors
• Light weight for overall minimal weight increase
• Good heat exchange efficiency to reduce fans noise

Solution:

• Compact and ultra slim soldering free module design with stacked fins with optimal heat exchange area and maximized performance
• Aluminum base with stamped features to contact multi-heat sources