繁體中文 
English The fast development in computers microprocess requires increasing electrical power for operation and creates a higher thermal power, which demands superior thermal solutions with heat pipes to ensure the functionality and lifetime of the electronic devices.
Challenge:
- Cooling solution in slimmest possible size
- 10~60 watts of dynamic heat flux from microprocessors
- Light weight for overall minimal weight increase
- Highest possible active heat exchange efficiency to reduce fans noise
Solution:
- Compact heat pipe module design within custom developed mechanics
- Multi flattened heat pipes to transport the thermal power from multi sources to the fin heat exchange area
- Heat pipes is designed to work best in different orientation
